Step 1 From File to Film
Step 2 Material Cutting
Starting as a large sheet, standard industry quality FR4 in 0.4/0.6/0.8/1.0/1.2/1.6/2.0mm thicknesses with a high-quality copper foil bonded to both sides - referred to as laminate - is cut to into all kinds of suitable sizes to make panels.
Step 5 Image the outer layers
Step 6 Pattern Plating
Step 7 Etching
Step 8 AOI Inspection
Automated optical inspection(AOI) is an automated visual inspection for bare boards. An AOI is able to detect faults such as tracks with over etched edges or regions where the photoresist may have been scratched or chipped and so caused a notch in the track. Faults such as this are very hard to detect in an electrical continuity test.
The AOI system scans the layers using a laser sensor. The captured image is digitized, enhanced and then electronically compared with the original Gerber file. Using this comparison the AOI system is able to detect and highlight any defects or suspect areas far more swiftly and accurately than manual inspection.
Step 9 Solder Mask
Silkscreen guides customers to better understand the board’s component layout.
The panel is then cured again to finally harden off the solder mask and silkscreen inks.
Step11 Surface Finish
Step 12 Profiling & V-cutting
V-scoring/V-cutting is used for mechanical pre-separation of circuit boards. A V-shaped breaking line is formed in the circuit board with a precision cutting tool. These breaking lines permit the boards to easily be snapped out from the panel.
Step 13 Electrical test
We electrically test every multilayer PCB against the original board data. Using a flying probe tester we check each net to ensure that it is complete (no open circuits) and does not short to any other net.
Step 14 Final Quality checking & Package & Shipping